GoReflow-plus convection reflow soldering system has eight heating zones and active heated area of 2,980mm.

Is designed for soldering in ambient atmospheres and can be operated with local nitrogen inertion in peak area. High volume of circulated process gas, generated with axial fans and slot nozzles, ensures homogeneous heat distribution over transport width at simultaneously moderate gas velocities; good heat transfer rate is realized, allowing set temperatures of oven at low level. Is equipped with 3-stage cooling area to cool assemblies after reflow. Flux management system (process gas cleaning) with stainless steel filter is integrated in peak and cooling area. Residues are collected in PE bottle.

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