Sarcon PG45A is a putty-like thermal interface material.

Modulus gap filler exhibits thermal resistance as low as 0.02°C•in²/W at 43.5PSI with thermal conductivity of 4.5W/m°K. Requires low compression force at high compression rates. Is reportedly ideal for applications that have delicate or wide-variation component heights requiring material compression up to 70-90%. Is available in three sheet thicknesses (1.5, 2.0, and 2.5mm) up to a max. dimension of 300mm x 200mm. Can be ordered in die-cut form to fit almost any application shape. Is for environments with operating temp. ranging from -40° to +150°C.

Fujipoly America
fujipoly.com

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