TRI Launches TR7007D/Q Plus 3-D SPI
Published: 07 May 2020
TR7007DQ Plus 3-D solder paste inspection is equipped with improved motion controller (EtherCat) and enhanced 2-D light module.
Motion controller achieves real-time measurements and processing on the fly, while light module realizes higher uniformity inspection, less shadow, and improved imaging. Can accurately inspect low solder bridges and compensate board warpage for eliminating local PCB deformation. Is equipped with up to four projectors to ensure shadow-free inspection. Eases data exchange between production line and MES of choice to enable data traceability for connected factory.
Test Research Inc.
tri.com
