S3X70-G811 type 5 solder paste is for micro-pattern applications that can be reflowed in an air atmosphere.

Adopts new flux formulation optimized for type 5 solder powder and enables air reflow soldering of 0402 metric size components with the following product features: excellent meltability and wettability at the micro-patterns in air reflow; reduced stencil issues with newly developed lubrication technique; reduced voids with various board surface finish treatments. Has good melting properties.

KOKI Co. Ltd.
ko-ki.co.jp

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