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AuLTRA ThInForm ultra-thin precision AuSn preform is designed for semiconductor laser applications.

Is 0.00035" thick (0.00889mm or 8.89μm). 80Au20Sn preform improves operational efficiency of high-output lasers. Combats shorting; reduced solder volume inhibits wicking up the die. Reduces bond-line thickness, thus improving thermal transfer and increasing longevity and performance of device.

Indium AuLTRA ThInFORMS

Indium Corp.
indium.com

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