Indium Introduces AuLTRA ThInForm Preform
Published: 23 June 2020
AuLTRA ThInForm ultra-thin precision AuSn preform is designed for semiconductor laser applications.
Is 0.00035" thick (0.00889mm or 8.89μm). 80Au20Sn preform improves operational efficiency of high-output lasers. Combats shorting; reduced solder volume inhibits wicking up the die. Reduces bond-line thickness, thus improving thermal transfer and increasing longevity and performance of device.
Indium Corp.
indium.com
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