Dowsil TC-3065 one-part, thermally conductive gel was developed to dissipate high amounts of heat away from sensitive electronic components.

Fills gaps; has wetting ability and reportedly replaces fabricated elastomeric thermal pads. After curing, it eliminates silicone oil bleeding and has low levels of volatile organic compounds. Supports automatic dispensing and heat curing after assembly. Applications include telecommunications and data communications equipment. Is a soft, stress-relieving and shock-damping silicone gel with a thermal conductivity of 6.5W/mk. Has extrusion rate of 60g/m and supports auto-dispensing. Resists slumping during vertical assembly and fills uneven spacing. Accommodates higher part-to-part tolerances that can challenge fabricated thermal pads with constrained dimensions. Is supplied as non-flowable gel and supports bond line thickness as thin as 150µm when high pressure is applied. Dispensable onto substrates such as aluminum heatsinks and encapsulated chips that have an epoxy surface. After assembly, it can achieve curing by applying 100°C for 30 min. (or 80°C for 60 min.) or from heat generated by component. If rework is required, it can be removed without leaving residue after curing. At room temp., working time or open time is generally five days. Can be used for optical transceivers, ethernet switches and routers, high-speed solid-state disks and other network devices.

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