Delo Offers Monopox EG2596 Die Attach Adhesive
Delo Monopox EG2596 die attach adhesive offers high strength after aging.
Reportedly can be dispensed more precisely than predecessor Delo Monopox MK096. Fluorescent adhesive is suitable for long-term use in semiconductor and SMT applications. Can be used on PCBs to fix components and act as electrical insulation. Is temperature-resistant and offers good dispensing properties. Is suited for long-term use; heat-curing, one-component epoxy resin adhesive reportedly exhibits a 150% higher strength after seven days of storage at 85% relative air humidity and temp. of +85°C. Maintains strong adhesion after typical aging tests like MSL1 in accordance with JEDEC. When using 1 x 1 mm² silicon dies, test revealed adhesion values of 47N on FR4 substrate and 62N on gold. Has a thixotropy index of ~ 9. Can be dispensed by jet valves and needles. Drop sizes down to below 250µm can be achieved. Curing takes place in 10 min. at +130 °C.
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