WS-829 for printing and pin transfer applications, including LED die-attach, can be used for ball-attach on substrate in a standard BGA process, especially for sphere applications <0.25mm, as well as wafer-/panel-level packaging.

Water-soluble and halogen-free. Cleans with DI water; cleans contamination or pad oxidation from processes before ball mount. Has high tackiness. Ensures consistent flux definition over long periods of time with minimal slump.

Indium Corp.
indium.com

Register now for PCB West Virtual 2020, the leading conference and exhibition for the printed circuit board industry, happening this week. pcbwest.com

• Prev
• Next