MRSI-705 high-volume configuration 5μm die bonder offers horizontal turret feature to increase speed and throughput without sacrificing flexibility, accuracy, or reliability.

Delivers on-the-fly tool change with up to 12 tools with zero tool changeover downtime. Applications include photonic packaging, microwave modules, RF power amplifiers, and infrared sensors.

MRSI Systems
mrsisystems.com

PCB West Virtual 2020 has more than 125 hours’ worth of technical sessions on printed circuit design and manufacturing available through Oct. 12.  pcbwest.com 

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