Siplace SX pick-and-place machine has new placement head versions, a more powerful vision system, open interfaces for special feeders and new software functions.

SpeedStar CP20 head raises placement performance to up to 43,250 components per hr. Siplace MultiStar and Siplace TwinStar heads can handle larger and more complex components and place them with force of up to 100N. Blue light of new camera system allows for more component-specific illumination settings and multiple exposures from which 3-D images can be computed. Includes OSC package for odd-shaped components, passive clinching tool for THT processes, and multi-touch monitor and smart support functions. Siplace SpeedStar features up to 17% more placement performance, 12% more accuracy, and component spectrum that is 37% greater. Can place components up to 50mm tall and 240gm with forces of up to 100N. Can check condition of pins and other characteristics in addition to component’s shape and size by turning multiple images into 3-D pictures and inspecting user-defined features on all sides. Has open third-party feeder interface. Siplace PowerConnector X supplements other options like Siplace GlueFeeder X and Siplace MeasuringFeeder X on changeover table.

ASM Assembly Systems
asm-smt.com

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