Akrometrix Upgrades AXP2.0-DFP Thermal Warpage System
Published: 30 October 2020
AXP2.0-DFP2 thermal warpage system now comes with second generation Digital Fringe Projection (DFP2) Vision Technology, which adds step height measurement capabilities at high data point density.
The technique is useful for measurement of connectors, sockets, assembled modules, and PCB local areas. Comes as field upgradeable option.
Akrometrix
Press Releases
- Indium Corporation Technical Expert to Present at SiP Conference China
- Flex Announces Kevin Krumm as Chief Financial Officer
- Green Circuits Enhances Inspection Capabilities with New DAGE Quadra 5 Pro X-ray System
- Western Digital CEO David Goeckeler Elected Chair of Semiconductor Industry Association