Bergquist TGF 4500CVO liquid gap filler combines thermal performance, high dispense rate and controlled volatility.

Designed as a two-component material, it is built on a silicone chemistry platform capable of dispensing at speeds up to 300g/min., depending on the pattern. Thermal conductivity is 4.5 W/m-K. Has low assembly stress, thoroughly wets out for optimized heat transfer and can be used without fear of contamination. Minimal thermal changes at temperature up to 200°C. Room temperature storage.

Henkel

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