OM-372 Pb-free, no-clean solder paste is designed to provide ultra-high electrochemical reliability on fine-pitched, low-standoff components.

Is formulated to deliver low post-reflow residue and superior transfer efficiency on fine feature pads as low as 80 x 130µm (008004). Is reportedly ideal for high board density applications requiring smaller, thinner, and lighter form factor components. Minimizes post-reflow defects such as HiP/NOW. Provides advanced SIR performance. Is available in Type 5 and Type 6 powder. Requires nitrogen reflow (≤1000ppm O2).

MacDermid Alpha
macdermidalpha.com

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