SMT 158D8 high thermal conductive underfill is a diamond-filled, reworkable liquid epoxy. Has thermal conductivity of >6W/mK, high salt-moisture resistance, and excellent adhesion.

Can flow into small gaps with no phase separation. Drop test reportedly has been improved by two orders of magnitude compared with use of solder paste. Can lower CPU (POP) temp. by 10°C. Can be used as underfill for flip chip, chip scale package, ball grid array devices, package on package, and land grid array application. Is also suitable for bare chip protection in advanced packages such as memory cards, chip carriers, hybrid circuits and multichip modules.

Yincae Advanced Materials
yincae.com

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