PicoShot NC-5M jetting solder paste is designed for halogen-free no-clean SAC 305 solder paste for Mycronic MY600/MY700 jetting systems or add-on and repair modules.

Can be used in standalone applications such as system-in-package, jetting into cavities, stencil replacement, shield attach, and microBGA. Complements stencil printing of Indium8.9HF. Can be cleaned with standard cleaning solutions. Formulation meets or exceeds ANSI/IPC J-STD-004B ROL0 requirements; halogen-free requirements per IPC and IEC61249-2-21 standards; IPC standards for SIR and ECM. Reflows in air or nitrogen (ppm O₂ level from 50-1,000). Has clear residue with minimal flow-out. Reduces head-in-pillow. Eliminates or significantly reduces graping. Minimizes reflow spatter.

Indium Corp.
Indium.com

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