Pilot AOI software v. 6.5 includes improvements for test functions, program creation and optimizations.

New function for 3-D inspection at THT solder joints increases measurement accuracy at pins with possibility of presetting position and min. and max. length of pin. Measurements can be performed on pin solder joints, with min. and max. solder height and wetting preset. THT test functions are integrated into automatic test program creation with MagicClick. Measured value recordings reduce possible interference. 3-D inspection of unpopulated PCB areas has been integrated. This inspects for defects such as solder beads, solder splashes, and lost and superfluous components. Defect detection is based on height differences. Interfering influences on the measurements, for example reflections on the PCB material or position imprints, reportedly have no effect on measurement results. History with comparison function provides version history with option of restoring older project versions. Can record differences between two revisions. Provides detailed information about user, workstation and software version. Is available for 3-D AOI and SPI systems, both for SMD and THT inspection.

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