Siplace TX Micron has improved 20-nozzle SpeedStar high-speed placement head.

Places up to 96,000 components per hr. Placement accuracies are 25, 20 and 15µm @ 3σ. Can operate with component pitches of as little as 50µm. Can place 0201m components at full speed. Functions for thin-die handling deliver higher yields when assembling system-in-package modules or submodules. Includes 4mm version of Smart Feeder Xi. Can be individually programmed for each component and placement position. Includes touchless pickup and zero-force placement. Footprint is 2.23 x 1m.

ASM
asm-smt.com/en/

PCB EAST: The original East Coast technical conference and exhibition! Returning to the Boston suburbs in June 2021! 

• Prev
• Next