Amkor Rolls Out DSMBGA Technology
Published: 10 August 2021
Double-sided, molded ball grid array is for 5G RF module design, characterization and packaging technology.
Increases level of integration for RF frontend modules used in smartphones and other mobile devices. SiP design rules and DSMBGA enable integration of antenna tuners and passive components. Improves signal integrity and reduces losses, resulting in improved Rx/Tx amplification.
Amkor Technology
amkor.com
