EP5G-80 is a one-component, NASA low outgassing rated epoxy with temp. cure requirement of 80°C for 4 hr.

Graphite-filled compound is not premixed and frozen and has unlimited working life at room temp. Offers electrical conductivity with a volume resistivity of 5-15 ohm-cm and thermal conductivity of 2.88-3.46 W/(m•K) at room temp. Designed for heat-sensitive electronic applications where high levels of conductivity are desired. Provides Tg of around 130°-140°C; tensile modulus exceeds one million psi at room temp. Serviceable over temp. range of -50°C to +175°C. Has low coefficient of thermal expansion. Suitable for bonding, sealing and coating. Adheres well to metals, composites, ceramics and many plastics. Features good lubricity and can be employed for static dissipation and EMI/RFI shielding applications. Is black in color and RoHS compliant.

Master Bond
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