EO-B-016 no-clean, alcohol-based flux has been developed for selective soldering.

Is also suited for use in wave and manual soldering processes, as well as for dip soldering and strand tinning. Application can be done by all common application methods except foaming. Solids content is 5% by weight. Has good soldering properties, especially in terms of penetration, wetting and cleanliness; good soldering results can be achieved on overaged or overlaid PCBs and components. Process window is wide, with high thermal stability and good process activity over long-time interval. PCBs are reportedly almost residue-free after soldering. Is based on alcohol with di-carboxylic acid activator complex and synthetic resin.

Emil Otto
emilotto.de

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