Grypper test sockets are for BGA devices, including large array ASICs; I/O down to 0.35mm pitch.

Can be designed to any I/O count specific to custom BGA requirements for characterization, validation and failure analysis. G80 LIF allows testing of 896 I/O, 31 x 31 0.80mm pitch BGA package. Small socket is 12-ball socket at 0.40 pitch and 1.2 x 1.6mm; incorporates built-in alignment corners. To connect device, insert into socket by pressing on top of device; no lid is required. Contact grips onto solder balls of device. Extraction tool can be used to pop device out of socket. Has electrical performance of -1dB insertion loss to greater than 40.0GHz. Force required to insert a device is 25gm/contact. Configurations: Socket with Rohs solder ball (SAC 305) replicates device; socket configured with SnPb solder ball allows reflow/attachment onto PCB that already has components mounted. Lower melting temp. of SnPb solder will not affect any adjacent components that might be close to target area where socket is to be placed. Socket can be purchased with no solder balls. Non-solder-ball version requires use of 0.2mm-thick stencil for correct amount of solder paste.

Ironwood Electronics
ironwoodelectronics.com

• Prev
• Next