Indium, Safi-Tech Announce Supercooled BiSn Solder Paste
Published: 13 October 2022
Supercooled BiSn solder paste encapsulates liquid metal in soft shell to keep solder alloy below its normal freezing point.
Shell can be removed via traditional flux and reflow process or burst by compression. Can reportedly be fluxed and reflowed at 135°C. Target applications include flexible hybrid electronics and heat-sensitive applications currently using conductive epoxies.
Indium Corporation
