Indium Corporation's LEDPaste NC38HF combines superior wetting performance with excellent stencil print transfer efficiency to satisfy the broadest range of process requirements for miniLED applications. Offers printability down to 60-micron apertures with excellent compatibility with the current size of miniLEDs and as future die continue to miniaturize.

Is said to feature consistent and tight solder deposit spread across multiple prints and excellent response-to-pause characteristics and minimal voiding on tight-pitch components to ensure joint strength on small components. Also offers on-wet open (NWO) performance using superior oxidation barrier technology, enabling reduced solder ball and solder beading defects and enhanced graping performance, plus enhanced slump performance with minimal bridging during the assembly process, improving yields for tight-pitch components.

Indium Corporation

www.indium.com

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