Parker's Therm-A-Gap Gel 60HF high-flow thermal gel provides flow rates of up to 100g/min and is designed for companies manufacturing consumer electronics, telecommunications equipment, energy storage devices, power supplies and semiconductors, automotive control units and sensors, and computing components such as CPUs and GPUs.

Is optimised for automated dispensing at various packaging sizes, while retaining properties for easy rework and field repair situations. Paste-like consistency enables tightly controlled dispensing and accurate material placement during assembly, and requires low compressive force to deflect under assembly pressure, minimising stress on components, soldered joints and PCB leads. Is said to offer higher flow rate attributes than other products in materials family while maintaining long-term thermal stability and reliability. Features a thermal conductivity of 6.2W/m-K to facilitate optimal heat transfer from electronic components to cooling features. Can be stored and transported at room temperature and has no post-cure requirements.

Parker Hannifin

www.parker.com

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