Master Bond's Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy formulated to serve as the damming compound in dam-and-fill encapsulation applications.

Can also be utilized for bonding and sealing, especially where no flow is needed since the material cures in place and will not run or slump. Requires a relatively low heat cure of 85°C for 2-3 hours, is thermally conductive and electrically non-conductive. Features a thermal conductivity of 5-10 BTU•in/ft2•hr•°F [0.72-1.44 W/(m·K)] and is said to play an important role in facilitating effective heat dissipation and preventing overheating, especially in densely packed electronic assemblies. Maintains a Shore D hardness of 75-85, offers excellent damp heat resistance and has a good physical strength profile. Serviceable from -100°F to +350°F (-73°C to +177°C).

Master Bond

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