Hitachi High-Tech launched LS9300AD, for inspecting the front and backside of non-patterned wafer surfaces for particles and defects.

In addition to the conventional dark-field laser scattering detection of foreign material and defects, comes is equipped with a new DIC (Differential Interference Contrast) inspection function that enables detection of irregular defects, even shallow, low aspect microscopic defects. Has wafer edge grip method and rotating stage currently used in conventional products to enabling front and backside wafer inspection. Is said to enable reduced inspection costs and improved yield for semiconductor wafers and semiconductor device manufacturers by providing high-sensitivity and high-throughput detection of low-aspect microscopic defects.

Hitachi High-Tech Corp.

https://hha.hitachi-hightech.com

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