Master Bond's EP114 is a two component, low viscosity, NASA low outgassing rated, heat cured epoxy that can be effectively utilized for underfill, coating, impregnating and porosity sealing applications.

Features high dimensional stability due to its nano-silica filler material and has been successfully tested for abrasion resistance per ASTM D4060-14 and readily withstands 1,000 hr. at 85°C and 85% relative humidity. Is said to have excellent electrical insulation properties with a volume resistivity greater than 1014ohm-cm and a dielectric constant of 3.35 (60Hz) at 25°C. Features an exceptionally low coefficient of thermal expansion of 20-22 x 10-6in/in/°C, a compressive strength of 24,000-26,000psi, an ultra-high modulus of more than 1,000,000psi and a hardness of 85-95 Shore D at 25°C. Also has a glass transition temperature of more than 200°C, features a mixed viscosity of 500-1,500cps and offers a long working life after mixing.

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