Shenmao PF719-P250A solder paste is said to have high anti-thermal fatigue reliability for AI substrate power management modules.

The lead-free alloy (Sn/3.9Ag/0.6Cu/3.0Sb) features

• • Halogen-free (ROL0) with no intentionally added halogen, ensuring compliance with RoHS, RoHS 2.0, and REACH standards.
• • Outstanding voiding performance, enhancing overall solder joint reliability.
• • Anti-thermal fatigue performance, ensuring long-term durability in high temperature environments.
• • Resistant to multiple reflows, providing consistent performance across various assembly processes.
• • Solderability and printability, facilitating smooth and precise application in manufacturing processes.

Has received certification from major power management module manufacturers.

Shenmao Technology

www.shenmao.com

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