TopLine's new braided solder columns are designed to serve as a drop-in replacement for solder spheres used in BGA components.

Are said to be especially suited for cryogenic environments and next generation applications, and provide improved reliability and thermal properties over competing technologies. Are non-collapsible, RoHS compliant, and lead-free, and are designed to absorb destructive strain caused by differences in the CTE of materials between large sized heterogeneous 2.5-D packages and FR-4 PCBs.

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