Indium's Heat-Spring HSx thermal interface material is designed for large area dies with warpage of 200 microns or more.

Delivers 16W/m-K thermal conductivity at 20psi, making it ideal for test heads with clamping forces of 30psi or less. Available in thicknesses from 300 microns to 1mm, and can be customized with or without a diffusion barrier to prevent die staining.

Indium Corp.

indium.com

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