Yincae Announces UF 158UL Underfill
Published: 13 March 2025
Yincae UF 158UL underfill is said to fill gaps as small as 10 microns, even in 100x100mm chips.
Unique formulation cures rapidly at room temperature. Provides protection against thermal stress, moisture, and mechanical shock. Is for a range of applications, including:
• High-performance computing
• Artificial intelligence
• Automotive electronics
• Aerospace systems
Yincae
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