Saki Enhances 3Xi-M200 AXI
Published: 14 April 2025
Saki Corp. 3Xi-M200 AXI now has upgraded software improves solder joint defect detection for power modules, including those with thick baseplates and heat-dissipating finned structures. Adjusts for brightness fluctuations resulting from structural height variations within a module, for clearer, more stable imaging, particularly in complex modules.Page Break
Saki Corp.
sakicorp.com
Press Releases
- Saki America, Inc. Hires Jacob Doose as Service Engineer in Chicago Area
- Novair USA Joins Forces with New Representative PIT Equipment
- BTU International to Discuss the Aurora Line of Solder Reflow Ovens at the SMTA Capital Expo
- PCBAIR Invests in AI to Enhance Defect Prediction in PCB Manufacturing; Dr. Jian Li and Sarah Chen Comment