Shenmao Offers PF606-P Lead-Free Solder Paste
Published: 15 April 2025
Shenmao PF606-P lead-free solder paste for use in "reverse hybrid" board assembly is compatible with existing SAC SMT materials and reflow processes.
Offers enhanced thermal cycling (TC) and drop test reliability and superior solder joint homogeneity and mechanical performance. Novel flux ensures tight void control and reduces risk of short defects caused by ball expansion from void formation.
Shenmao
Press Releases
- ECIA Launches Webinar Series ‘Are Date Code Restrictions Still Relevant’; Don Elario, Dan Deisz, and Eric Miscoll Comment
- Luminovo Hosts First U.S. Focused Webinar: Exploring Tariff Impacts on the Future of EMS; Sam Mason and Matthew Rosenberg Comment
- Semi-Kinetics Ensures High-Quality Manufacturing with New Totech XSD Series and Storage Manager Software; Michael Wayne Leedom Comments
- CE3S Partners with Nordson EFD to Deliver Advanced Fluid Dispensing Solutions; Jeremy Wagner Comments