Yincae's Diamond Underfill UF 158D is engineered to deliver exceptional thermal management in advanced semiconductor applications, achieving 8 W/m·K thermal conductivity through nano-engineered diamond particles. Designed for flip-chip, 2.5D/3D integration and high-density interconnects, UF 158D reduces solder fatigue, mitigates CTE mismatch and enhances long-term device reliability. Its strong adhesion and mechanical robustness make it well-suited for next-generation packaging demands. Available in both dispensable and jettable formulations, UF 158D has passed JEDEC reliability standards.

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