Shenmao has introduced PF602-P241M-HS, a low-temperature Sn-Bi solder paste engineered for assembling heat sinks and cold plates in AI server cooling systems. Designed to support advanced thermal management architectures, the paste minimizes warpage by soldering below 200 °C and delivers strong mechanical bonding for low-void joints. Its lead-free, halogen-free formulation ensures wetting on copper, aluminum and Ni-plated surfaces. Compatible with stencil printing and dispensing, PF602-P241M-HS enhances cooling efficiency and thermal reliability in both air- and liquid-cooled server designs. 

Shenmao

https://www.shenmao.com/

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