The YRH10W hybrid placer is a wide-type placement system designed to support both semiconductor die bonding and surface-mount component placement within one platform. Expands capability to accommodate 12-inch wafers and large-format printed circuit boards up to L510 × W460mm. Combines bare-die handling and SMT placement functions, delivering a bare-chip placement speed of up to 14,000 components per hour when supplied with wafers, along with placement accuracy of ±15µm. Designed for flexible production environments. 

Yamaha Motor

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