Intersurface Dynamics Introduces Candeo Post-CMP Cleaning Chemistry
Published: 29 June 2026
Candeo is a post-CMP cleaning chemistry designed to remove residual particles and ionic contamination, reducing defectivity and increasing usable wafer area for silicon, silicon carbide and advanced packaging applications. Compatible with Entrepix DSS-200 cleaning platforms without hardware modifications, the formulation provides a wider process window, supports stable, repeatable cleaning performance, and is free of the strong odors associated with conventional ammonium hydroxide-based chemistries. The chemistry is available for process evaluation through Intersurface Dynamics and Entrepix.
Intersurface Dynamics
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