HANGZHOU, CHINA – Scanfil EMS is selling the entire share capital of its subsidiary Scanfil (Hangzhou) Co. for €18.4 million to Hangzhou Cabinet Technology, a mechanics manufacturer.

ATLANTA – The tide is turning positive for large-scale reopenings among electronics components suppliers over the rest of the year. That’s according to the ECIA’s latest member survey, conducted June 16 to 22, which noted measured optimism in the transition between the end of the second quarter and the end of the fourth.

FRAMINGHAM, MA – Vendor revenue from sales of IT infrastructure products (server, enterprise storage, and ethernet switch) for cloud environments, including public and private cloud, increased 2.2% in the first quarter, while investments in traditional, non-cloud and infrastructure plunged 16.3% year-over-year, according to International Data Corp.

DE LEON SPRINGS, FL – Sparton Corp. has entered into a definitive agreement to sell its contract manufacturing unit, Manufacturing and Design Services, in a deal between private equity firms.

KUALA LUMPUR – After VS Industry Berhad posted a net loss of RM19.5 million (US$4.6 million) for its fiscal third quarter ended April 30, analysts expect the firm’s fiscal fourth quarter to be profitable, despite challenges related to Covid-19, according to reports.

BAC GIANG, VIETNAM – Foxconn said Vietnam is its largest manufacturing hub in Southeast Asia, say reports. The EMS/ODM company, the world’s largest according to the CIRCUITS ASSEMBLY Top 50, did not indicate whether it includes China as part of the geography.

TAIPEI – Pegatron and EMS firm Qisda are opening new factories in Vietnam, according to reports. Pegatron will rent a plant that will begin production in early 2021, and Qisda is constructing a new factory.

BANNOCKBURN, IL — May North American PCB shipments were up 1% year-over-year and down 3% sequentially, says IPC.

ASHEVILLE, NC – Charles Edward Industries plans to invest $1.5 million in a new EMS plant here over the next three years.

BANNOCKBURN, IL – IPC and High Density Package Users Group have signed a memorandum of understanding, enabling a partnership, increased technical collaboration between groups, and a mutual path toward emerging and disruptive high-density interconnect technologies.

PISCATAWAY, NJ – The 66th annual IEEE International Electron Devices Meeting will be a virtual event Dec. 12-16.

ATLANTA – ECIA is convening experts to help modernize the component distribution channel’s design registration process. The trade group is assembling a group of subject matter experts and industry stakeholders representing the authorized component channel to include semiconductors, electromechanical/interconnect and passives, and will develop a multiphase initiative to assess the current state and what the future state might look like.