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PHILADELPHIA – The American Competitiveness Institute will sponsor a free electronics adhesives workshop on July 11, in Philadelphia.
The guest speaker is Brian Toleno, Ph.D., director of technical service for Henkel Electronic Materials, who will discuss differences between physical properties of flip-chip and board-level underfill, and how these properties affect underfilled device reliability. In addition, he will discuss different classes, such as cornerbond or edgebond materials and encapsulants, and their effects on reliability.
To register, visit http://www.aciusa.org/workshop or email registrar@aciusa.org by July 9.
The guest speaker is Brian Toleno, Ph.D., director of technical service for Henkel Electronic Materials, who will discuss differences between physical properties of flip-chip and board-level underfill, and how these properties affect underfilled device reliability. In addition, he will discuss different classes, such as cornerbond or edgebond materials and encapsulants, and their effects on reliability.
To register, visit http://www.aciusa.org/workshop or email registrar@aciusa.org by July 9.
EINDHOVEN, THE NETHERLANDS – The Holst Centre has inaugurated its roll-to-roll line for printed electronics.
SAN JOSE – North America-based manufacturers of semiconductor equipment posted $1.03 billion in orders in May, down 5% sequentially, and down 37% year-over-year, SEMI reported.
SHENZHEN – Privately held Huawei Technologies, China's largest communications network equipment maker, is contemplating the sale of a majority stake in its handsets and terminal operations, according to published reports.
The firm reportedly has sent proposals to Bain Capital LLC, Blackstone Group LP, TPG Inc., Kohlberg Kravis Roberts & Co., Warburg Pincus LLC, Carlyle Group, and other private equity firms.
The company has set a deadline of June 23 for bids, and has appointed Morgan Stanley to manage a possible sale, say reports.
The funds would aid in the investment in Huawei’s routers and other network gear.
Research firm BDA China Ltd. estimates the firm doubled its revenue last year to $2.6 billion. The handset division is said to have taken in profits of $400 million during this same period. Sales for the division were 16.4% of the company’s total revenue in 2007, up from 11.8% in the prior year, according to BDA.
SMYRNA, GA – UP Media Group Inc., parent company of Circuits Assembly and Printed Circuit Design & Fab, today announced registration is now open for PCB West 2008, scheduled for Sept. 14-19, at the Santa Clara Marriott in Santa Clara, CA.
SHERWOOD, OR – Ascentec Engineering has acquired Datum Dynamics USA for an undisclosed sum.
Portsmouth, RI-based Datum will move to Ascentec’s Fitchburg, MA site. Colin Reddy, previously sales manager at Datum, will help transition current Datum clients.
Ascentec designs and manufactures PCBA process tooling.
Datum is a PCB assembly tooling and fixtures supplier in the Northeastern U.S.
SINGAPORE – Nihon Superior Co. Ltd. has upgraded its Singapore location – Nihon Superior Trading (S) Pte Ltd. – to a regional headquarters, with plans to establish an English-speaking R&D center there.
The R&D Center will be in operation before the end of 2008 with an initial investment of SG$1.275 million (US$934,000), the company reports.
The initial focus will be on establishing analytical capability with XRF and ICP equipment. Additional tools required for the development and testing of soldering materials and the diagnosis of microscopy and mechanical testing will follow.
NSTS was established in 1988 as a joint venture with Matsushita Electric Industrial Co. Ltd. In 2007, NSTS accounted for 16% of Nihon’s total turnover.
BANNOCKBURN, IL – John Hartner, executive vice president of Dover Technologies, has been named chairman of the IPC Surface Mount Equipment Manufacturers Association (SMEMA) Council Steering Committee.
Leo van de Vall, president and CEO of Assembléon America Inc., has been named vice chairman.
In a release, Hartner said he looks to engage all industry segments, not just the equipment OEMs SMEMA represents. “Our ability to cooperate in solving industry-wide issues benefits everyone in the supply chain, including customers, suppliers and channel partners,” said Hartner. ”Leo and I hope to lead SMEMA to be more global and more valuable to all members, big and small.”
The SMEMA Council is made up of electronics assembly suppliers. It initiates technical, managerial, and financial programs to improve supply chain efficiencies and enhance working relationships and equipment compatibility.
Leo van de Vall, president and CEO of Assembléon America Inc., has been named vice chairman.
In a release, Hartner said he looks to engage all industry segments, not just the equipment OEMs SMEMA represents. “Our ability to cooperate in solving industry-wide issues benefits everyone in the supply chain, including customers, suppliers and channel partners,” said Hartner. ”Leo and I hope to lead SMEMA to be more global and more valuable to all members, big and small.”
The SMEMA Council is made up of electronics assembly suppliers. It initiates technical, managerial, and financial programs to improve supply chain efficiencies and enhance working relationships and equipment compatibility.
SAN JOSE – Worldwide semiconductor manufacturing equipment billings reached $10.56 billion in the first quarter, up 7% sequentially, and down 2% year-over-year, according to SEMI.
The association also said worldwide semiconductor equipment bookings were $8.08 billion for the quarter, down 23% year-over-year, and down 11% sequentially.
“While bookings have weakened in the first quarter, overall industry billings remain at levels higher than the end of last year,” said Stanley T. Myers, president and CEO of SEMI. “Some regions, specifically North America, Korea and China, posted strong quarter-over-quarter growth in spite of the conservative capital environment.”
The association also said worldwide semiconductor equipment bookings were $8.08 billion for the quarter, down 23% year-over-year, and down 11% sequentially.
“While bookings have weakened in the first quarter, overall industry billings remain at levels higher than the end of last year,” said Stanley T. Myers, president and CEO of SEMI. “Some regions, specifically North America, Korea and China, posted strong quarter-over-quarter growth in spite of the conservative capital environment.”
SALEM, OR – Electronics manufacturers pursuing individual or group recycling programs in compliance with Oregon's new electronics recycling law must submit plans by July 1.
NEW YORK – Vietnam’s January 2007 entry into the World Trade Organization set in motion what’s become a fast-growing electronics manufacturing locale. The Southeast Asian nation’s low labor cost, availability of trainable local population and favorable government policies are attracting global EMS/ODM companies to set up operations, says research firm Frost & Sullivan.
COLORADO SPRINGS – Photo Stencil has expanded its capacity in the US and abroad, adding an LPKF StencilLaser G 6080 at its Colorado Springs headquarters.
The company also upgraded its photoplotting infrastructure and added electroformed stencil manufacturing capacity and capability, and expanded its manufacturing facility in Penang, Malaysia.
The company also upgraded its photoplotting infrastructure and added electroformed stencil manufacturing capacity and capability, and expanded its manufacturing facility in Penang, Malaysia.
Press Releases
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- KIC to Exhibit at Four SMTA Expo & Tech Forums in August
- Genie Electronics Leverages Cetec ERP for Superior Efficiency and Customer Service
- Automatic Nozzle Height Adjustment Reduces the Potential for Soldering Defects in Wave Soldering Processes