Altus Group, a leading distributor of electronics manufacturing equipment in the UK and Ireland, has reported a rise in enquiries from manufacturers looking for guidance on specifying convection reflow ovens for SMT production lines. One of the most common early considerations is how many heating zones are required, a decision that can influence throughput, footprint and long-term process capability.

As manufacturers compare available systems, Altus highlights that zone count alone does not provide a full picture of reflow performance. Differences in mechanical build between oven suppliers mean that systems with identical zone numbers can behave very differently in production. Heated length and cooling length therefore offer a more reliable indication of the usable thermal process window and achievable conveyor speed.

In the Heller platforms supported by Altus, configurations range from compact systems with heated lengths of around 1.3 m in five zones and 0.4 m of cooling, through to larger platforms offering 4.49 m of heated length across 13 zones with 1.66 m of cooling. Seven, eight and nine-zone models, including the Heller 1707, 1826 and 1809, remain popular choices due to their balance of footprint, performance and investment level.

Joe Booth, CEO of Altus Group said: “Reflow ovens can remain in service for two decades or more, so getting the specification right at the outset has long-term impact. Decisions around heated length, cooling capability and the operating window of the oven need to be made with a clear view of both current assemblies and those likely to be introduced later. Our focus is on helping manufacturers make well-informed decisions early in the project, so their investment supports production for many years.”

Throughput expectations continue to be a major factor in oven selection. As broad guidance, a seven-zone system may support takt times in the region of 45–60 seconds, while eight- and nine-zone systems typically achieve 30–45 seconds. In certain applications, optimised nine-zone ovens can operate below 30 seconds. Altus advises that these figures depend heavily on product design and must be validated through structured profiling.

To support this, the company recommends profiling representative assemblies using an external profiler such as Solderstar. Running these boards across different oven lengths and zone configurations helps establish where performance limits lie. Tools such as Solderstar’s Auto Seeker can also assist in assessing conveyor-speed headroom while maintaining the required thermal profile.

Altus has additionally seen increased interest in dual-lane reflow systems, particularly for manufacturers aiming to boost capacity without expanding their footprint. A dual-lane configuration can provide double the reflow capacity with the right board-size balance, and with appropriate upstream and downstream shuttles, can be integrated into production lines originally configured for single-lane operation.

www.altusgroup.co.ukwww.altusgroup.co.uk

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