WASHINGTON – The Semiconductor Industry Association released the following statement regarding the Trump Administration's announcement on tariffs on products imported from China:

TAIPEI -- New Kinpo Group is considering an initial public offering in the Philippines to generate funds for new investments in manufacturing and local marketing of its branded products.

WASHINGTON – President Trump’s decision to impose steep tariffs on Chinese imports will affect a number of products used in printed circuit board manufacturing and assembly.

TAIPEI – Foxconn and the University of Wisconsin-Milwaukee are reportedly launching an internship program to send engineering students to the electronics manufacturer’s headquarters here for a semester.

ST. PETERSBURG, FL – Jabil reported fiscal third quarter net revenue of $5.4 billion, up 21.1% year-over-year.

BANNOCKBURN, IL – IPC launched a global survey of OEMs this week. This confidential survey is part of a global data collection effort for the development of IPC’s 2018 PCB Technology Trends study.

HAYWARD, CA – Amazon Echo sold almost 20 million units globally last year, reaching 28 million installed units by the end of 2017, a new report says. Amazon Fire tablets stood at 27 million, and Fire TV at 26 million, adds FutureSource.

BANGKOK -- Foxconn has met with Thailand officials and is reportedly in interested in investing there, a top government administrator says.

MILWAUKEE, WI – Foxconn is expected to establish a regional headquarters here for some $10 billion, according to reports.

HERTFORDSHIRE, UK – The “true” wireless headphone segment grew 178% year-over-year in the first quarter, with Apple achieving 80% market share, according to Futuresource.

MILPITAS, CA – The semiconductor industry is nearing a third consecutive year of record equipment spending, with projected growth of 14% year-over-year in 2018 and 9% in 2019, according to SEMI.

ATLANTA, GA – JUNE 12, 2018 – PCB West today announced this year’s conference will feature two full tracks worth of free presentations on Wednesday, September 12, with topics ranging from signal integrity to 3D printing and common design errors.