MARKHAM, ON – E. Jan Vardaman, TechSearch International, will deliver the keynote at the International Conference for Electronics Enabling Technologies here. On June 5, she will discuss Dealing with the Challenges in the New Advanced Packaging Era.

The technical program has been finalized and registration is now open. ICEET will be held June 4-6, with the SMTA Ontario Expo on June 5.

Four professional development courses will be held June 4. Two courses are scheduled for the morning: Failure Analysis of Electronic Devices and Robust Coating Processes in the Factory: Methods, Critical Parameters, Problems and Remedies. The other two are slated for the afternoon: Shining a Light on LED Technology: Construction, Reliability, Qualification, Failure Modes and Tolerance Mistaken: Impacts of Not Properly Addressing Limitations of Material, Industry Standards and Assembly Process Limitations.

Conference sessions on June 5 and 6 will cover solder materials, harsh environment and fiber optics, failure analysis and reliability, components and substrates, ruggedization and conformal coating.

A panel discussion on Ruggedization - The Next Technology Wave is also scheduled.

For more information, visit https://www.smta.org/iceet/.

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