TAIPEI -- Global DRAM revenue reached a record high in the first quarter as vendors leveraged supply constraints to hike prices more than 30% on average.

WILSONVILLE, OR – FLIR Systems appointed James J. Cannon president and CEO, effective June 19.

MILPITAS, CA — North America-based semiconductor equipment manufacturers posted $2.17 billion in worldwide billings in April on a 90-day moving average basis.

LONDON -- International tin industry organization ITRI has launched a subgroup aimed at achieving a credible, responsible and more coordinated supply chain for tin.

OUD-TURNHOUT, BELGIUM – EOS/ESD Association is soliciting abstracts for the 12th annual International Electrostatic Discharge Workshop.

WESTLAKE, OHIO – Nordson reported fiscal second quarter sales were $496 million, up 13% year-over-year. Sales included a 9% increase in organic volume and 6% increase related to the first year effect of acquisitions.

FRANKFURT -- German region PCB fabricators reported sales rose 13.6% year-over-year in March.

FRANKFURT, GERMANY -- New orders for German electrical and electronic products soared 17% year-over-year in March, according to new data from ZVEI.

NOIDA, INDIA – Dixon Technologies filed its draft prospectus with the Securities and Exchange Board of India for an initial public offering.

KYOTO, JAPAN – At its 21st annual meeting this week, the World Semiconductor Council reaffirmed a core mission: to ensure government policies are guided by market-based principles. To that end, industry leaders adopted a set of guidelines and best practices on how to implement semiconductor support programs that are consistent with international rules and avoid harmful trade distortions.

JOKOPING, SWEDEN -- Kitron ASA today officially opened its EMS facility at Torsvik, celebrating in an event attended by customers, business partners, representatives of the local community and employees.

BANNOCKBURN, IL — A new survey finds more than half the responding companies currently produce or assemble through-hole boards designed to meet tolerances required by the use of press-fit assembly technology. One-third of those who produce only standard through-hole boards today anticipate the need to achieve these tolerances by 2021.