BANNOCKBURN, IL — Glenn Oliver of DuPont’s paper on high-frequency test methods has been selected as the best technical conference paper of IPC Apex Expo 2016. The paper will be presented Mar. 16.

MUMBAI, INDIA – The Maharashtra government hasn’t heard from Foxconn regarding its investment plans in the region, and is starting to get antsy.

STAMFORD, CT – Global smartphone sales to end-users totaled 403 million units in the fourth quarter, up 9.7% year-over-year, according to Gartner. It was the slowest growth rate since 2008.

BERLIN – Germany’s Federal Ministry for Education and Research has announced a 4-year, €400 million research framework for microelectronics.

LONDON – The global chip on board LED market is expected to exceed $9 billion by 2020, growing at a CAGR of over 35%, according to Technavio analysts.

WILSONVILLE, OR — Saying there is an urgent industry need for a printed circuit board assembly-specific Internet of Manufacturing standard interface, Mentor Graphics today announced the launch of the Open Manufacturing Language initiative. 

TAIPEI – Foxconn Electronics reported consolidated revenues of $10.1 billion for January, down 14.8% year-over-year and 17.6% sequentially.

TORSVIK, SWEDEN – Electronics manufacturer Kitron plans to relocate its Swedish operations to Torsvik, near its current facility in Jonkoping.

NEWARK, NY — IEC Electronics reported fiscal first quarter net sales rose 14.2% to $32.9 million as the firm's new management's policies are taking hold. 

FRAMINGHAM, MA – Worldwide personal and entry-level storage (PELS) shipments totaled 68.5 million units in 2015, down 9.2% year-over-year, according to the International Data Corporation.

ARLINGTON, VA – JEDEC Solid State Technology Association published a revised standard that establishes requirements for the next generation of semiconductor device package components: JESD30G.  

LITTLETON, MA – VJ Electronix and Apollo Seiko together have developed printed circuit board preheat to enhance the performance of robotic soldering.