NEEDHAM, MA – Global shipments of smart home devices continued to decline in the first quarter as shipments fell 5.6% year over year to 186 million units, according to the International Data Corporation Worldwide Quarterly Smart Home Device Tracker.

SINGAPORE – Scientists from Nanyang Technological University, Singapore; Panasonic Factory Solutions Asia Pacific; and Singapore Center for 3-D Printing have developed a new multi-material printer using multi-wavelength high-power lasers for quick and easy 3-D printing of smart, flexible devices.

WASHINGTON – The US Department of Commerce announced an expansion in funding opportunities for large semiconductor supply chain projects, as well as a separate process for smaller projects coming later in the year.

PIESTANY, SLOVAKIA – GPV has entered a lease agreement for a new electronics factory here in close proximity to its two existing factories in Slovakia. The additional factory is expected to start production from early 2024.

KOBIERZYCE, POLAND – Universal Scientific Industrial recently inaugurated its second factory here, and expects to create up to 1,000 jobs once the facility is fully operational by the first quarter of 2024.

TEMPE, AZ – Benchmark Electronics recently celebrated the grand reopening of its facility in Almelo, Netherlands serving customers across the aerospace and defense, industrial, medical and semiconductor capital equipment industries.

ATLANTA – ECIA Foundation announced the release of Phase II of its PACE e-learning modules. The PACE training program is a members only e-learning set of modules that explains the basics of the electronic components industry to new employees.

BANNOCKBURN, IL – Total North American PCB shipments in May 2023 were up 6.7% compared to the same month last year. Compared to the preceding month, May shipments were down 1.9%, according to IPC's North American Printed Circuit Board Statistical Program.

BANNOCKBURN, IL – Total North American EMS shipments in May were up 7.1% compared to the same month last year, according to IPC's monthly findings from its North American Electronics Manufacturing Services Statistical Program. Compared to the preceding month, May shipments decreased 5.2%.

HYDERABAD, INDIA – Cyient DLM's Rs 592 crore ($722 million) initial public offering will open for subscription on June 27 and close on June 30. The company has set a price band of Rs 250-265 ($3.05 to $3.23) per share.

MORRISVILLE, NC – The International Electronics Manufacturing Initiative (iNEMI) has announced the availability of three reports from the 5G/6G mmWave Materials and Electrical Test Technology Roadmap (5G/6G Maestro).

ATLANTA – ECIA’s Global Industry Practices Committee (GIPC) has published a ‘Knowledge Document’ to clarify and recommend practices to improve efficiencies in the electronic component sales channel. The document is entitled, ‘Managing Date Code Restrictions on Orders for Electronic Components’ and is now available on the ECIA website. The knowledge document was prepared as the result of a cooperative effort between electronic component manufacturers and their authorized distributors.