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SAO PAOLO -- Lenovo reportedly will announce the acquisition of Brazilian electronics manufacturer Comércio de Componentes Eletrônicos today, according to published local reports.

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SANTA CLARA, CA — Despite the gloomy global economy and concerns regarding the decline in sales of consumer LCD products, TFT LCD panel suppliers are still expecting shipments to grow 8% in 2012, according to NPD DisplaySearch.

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CUPERTINO, CA -- Is Apple underwriting Foxconn's wage increases?

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MALMO, SWEDEN -- Contract electronics assembler PanLink AB will acquire cable assembly company LRZ Commerce, the companies said today.

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TAIPEI -- Hon Hai Precision Industry (Foxconn) first-half revenue rose 25% year-over-year to NT$1.89 trillion ($63.2 billion) on higher demand for iPhones and iPads.

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MOUNTAIN VIEW, CA – Revenues for design services offered by electronics manufacturing service providers are expected to grow to $29.62 billion in 2018, a CAGR of 8.9%, a new report claims.

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STAMFORD, CT — Second quarter worldwide server shipments grew 1.4% year-over-year- while revenue declined 2.9%, according to research firm Gartner.

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BANNOCKBURN, IL — Year-on-year sales growth across the global electronics supply chain was mixed in the second quarter, but is now moving in a positive direction, according to the latest data from IPC.

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SON, THE NETHERLANDS – Neways' net profit fell to EUR 2.2 million in the first half, down from EUR 3.2 million a year ago.

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MILTON, NY — Ultrasonic coating equipment manufacturer Sono-Tek has restructured its organization and promoted Stephen Harshbarger to president.

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MONROE, OR -- The USNC/IECQ announced the formation of a Distributors Advisory Group to protect the US Department of Defense and general public by regulating policies and procedures necessary for counterfeit avoidance, detection, mitigation, and disposition, and assuring appropriate regulatory bodies implement them.

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SANTA CLARA, CA — Industry experts will gather at a pair of conferences in November to address the mounting challenges with semiconductor multi-die integration, and known good die requirements and benefits that 2.5/3D ICs offer.

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