BANNOCKBURN, IL – North American printed circuit board shipments in May decreased 2.6% year-over-year on seasonality. Orders increased 10.6% compared to May 2011, says IPC.

Year to date, board shipments were down 5.3%, and orders were up 2.6%. Sequentially, shipments increased 1.7%, while orders were up 3.3%.

The book-to-bill ratio decreased slightly, but continued in positive territory at 1.03 for the sixth straight month. A ratio of more than 1.0 suggests that current demand is ahead of supply, a positive indicator for growth over the next two to three months.       

Rigid PCB shipments were down 1.9% for the month compared to the same period last year, but orders increased 12% year-over-year. Year to date, rigid board shipments decreased 5%, while orders increased 3.1%. Sequentially, shipments were up 2%, and orders gained 1.9%. The rigid book-to-bill was 1.02.

Flexible circuit board shipments in May were down 10%, and orders were down 1.1% year-over-year. Year to date, shipments decreased 9.1%, and orders decreased 2.1%. Sequentially, shipments fell 2.6%, but orders were up 19.8%. The flex book-to-bill remained high at 1.17.         

“North American PCB sales and orders in May continued slightly below last year’s levels and reflected normal seasonal patterns,” said Sharon Starr, IPC director of market research. “The May book-to-bill ratio remained positive for the sixth consecutive month and was especially strong for the flexible circuit segment of the industry. This reinforces our hope that sales will gain strength in the second half of this year.”

In May, 83% of total PCB shipments were domestically produced. Domestic production accounted for 84% of rigid and 80% of flex PCB shipments.

In May, flexible circuit board manufacturers indicated bare circuits accounted for about 41% of shipment value.

COLORADO SPRINGS – As a result of Colorado wild fires, Photo Stencil was required to temporarily evacuate its headquarters here.

The firm says there is no immediate danger to its operation, but the evacuation is causing a short-term disruption to service.

For immediate questions, contact Neil MacRaild at nmacraild@photostencil.com (1-408-933-8434), or Rachel Short, rshort@photostencil.com (1-719-304-4224).

PASADENA, CA -- Price, availability and familiarity are the main factors behind purchasing decisions of Chinese electronics engineers.

TUCSON, AZ -- A survey last year of some 80 C-level executives found that rising wages in Asian countries, rising fuel costs, and extended supply chain risks is making nearshoring is a real consideration for companies that sell into the US market. That survey is now the subject of a podcast by The Offshore Group that provides details related to the survey's structure and methodology and analyzes the findings.

SUZHOU -- PC keyboard components manufacturer HTM International is reportedly automating production at its factory here, installing a series of self-developed lines said to replace 30 to 40 workers per line.

WASHINGTON -- The United States Patent and Trademark Office has assigned a patent for a printed circuit board connector to the employer of a pair of Taiwanese inventors.

LEATHERHEAD, SURREY, UK -- The printed circuit board industry has reached a turning point, as growth in China is mitigated by dips in other major electronics-consuming regions.

TOKYO -- OKI has finalized an agreement to acquire Tanaka Kikinzoku Kogyo's printed circuit board business in an all-stock deal.

ERLANGER, KY – A selective soldering seminar will take place here Sept. 25, hosted by Seho North America and Balver Zinn.

The one-day seminar will focus on precision in the selective soldering process, with the resulting demand for process optimization to improve both quality and cycle time. The seminar will provide theoretical background information followed by hands-on training.

Attendees will learn process teaching parameters; Pb-free selective soldering; typical issues in the selective soldering process, such as poor hole fill, solder bridging and solder balling; basic rules for board design to avoid difficulties in the production process, and process-related soldering defects and corrective measures.

Balver Zinn will present a practice-oriented lecture, highlighting the influence of flux on different solder processes and its impact on the long-term reliability of solder joints.

Additionally, a special focus will be placed on solder bath management to avoid solder contamination due to copper dissolution and other metals.

For more information, contact academy@seho.de.

EL SEGUNDO, CA -- With their main business in notebook PCs under pressure, original design manufacturers are adding new capabilities that will allow them to capitalize on the soaring sales of ultrabooks, according to the latest IHS iSuppli EMS & ODM Market Brief report.

TAIPEI -- Test Research Inc. said May revenue approached $20 million on demand for AOI, SPI and AXI inspection equipment and circuit board testers.

WASHINGTON – Brian Toohey, president and CEO of the Semiconductor Industry Association, released the following statement today in support of H.R. 6012, legislation introduced this week by Rep. Howard “Buck” McKeon (R-CA), Rep. Michael McCaul (R-TX) and Rep. William Keating (D-MA) to stop the flow of counterfeit semiconductor chips into the US: