ATLANTA – ECIA’s Global Industry Practices Committee, (GIPC) has published an ECIA Update document based on the five-year review process conducted by SAE’s AS6496 Standard Committee. There have been changes to the standard, which is out for the final vote. The updated version, AS6496A, is expected to be available by the end of the year.

LUTON, UK – AIM Solder UK has announced the acquisition of William Rowland Limited’s solder products business, encompassing solders and alloys.

NORTH YORK, ONTARIO – Permatech Electronics reported record revenue of $5.7 million for its 2023 fiscal year, an increase of 29% from last year.

WASHINGTON – Global semiconductor industry sales totaled $44 billion in August, an increase of 1.9% compared to July's total of $43.2 billion but 6.8% less than the August 2022 total of $47.2 billion.

PEACHTREE CITY, GA – CIRCUITS ASSEMBLY is accepting entries for its 2024 New Product Introduction Awards for electronics assembly equipment, materials and software suppliers.

NEEDHAM, MA – Global spending on cloud storage infrastructure increased 7.9% year-on-year in the second quarter to total $24.6 billion, according to the IDC's Worldwide Quarterly Enterprise Infrastructure Tracker: Buyer and Cloud Deployment.

WOKING, UK – TT Electronics has appointed Peter France as its new CEO to succeed Richard Tyson following the announcement made earlier this year of Tyson's departure.

CLINTON, NY – After partnering with the company last year to develop a supercooled liquid metal solder paste, Indium Corp. has announced the acquisition of Safi-Tech.

ST. PETERSBURG, FL – Jabil's board of directors has approved a $200 million restructuring plan that includes headcount reductions.

FONTENAY-AUX-ROSES, FRANCE – Icape Group has announced the acquisition of three US companies: PCB Solutions, Ustek Incorporated and Nujay Technologies.

SAINT HERBLAIN, FRANCE – Lacroix recorded revenue of €387.8 million ($409.9 million) in the first half of the year, up 14.6% from last year's first half.

WASHINGTON – The Department of Defense's Office of Industrial Base Policy has awarded a combined $17.5 million in contracts to support two initiatives that will strengthen the resilience of the defense microelectronics industrial base – including a project to promote production of ultra-high density interconnects for PCBs.