IRVINE, CA – TopLine has filed for a patent for solder columns for electronic components intended to operate in cryogenic environments.

"Some applications, including Quantum Computers, perform better at cryogenic temperatures, below what is known as the superconductivity point," said CEO Martin Hart. "This super-cold world is the normal environment for applications including lunar landings, deep space exploration, scientific sensors and instruments, and AI/ML data centers, to name only a few. But it’s also a place where thermal mismatch (CTE) between the device and the circuit board become more critical with extreme changes in temperature, possibly leading to failure.

"Traditional Ball Grid Array (BGA) spheres may fail. Recognizing this weakness, TopLine has developed a family of Braided Solder Columns for cryogenic environments and next generation applications, replacing solder balls on IC packages of varying sizes. These columns provide improved reliability and thermal properties over competing technologies, such as solder balls and heritage copper wrapped solder columns which simply aren’t equal to the task."

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