SIOUX FALLS, SD – Memory module assembler Legacy Electronics today said it has doubled its space with a new manufacturing facility here.

The 40,000 sq. ft. building provides for current and future production and expansion, with near term output expected to be triple that of current manufacturing.

The San Clemente, CA-based company says it plans to occupy the space in May and post job openings on its website by the end of the same month.

JEFFERSONVILLE, IN – Contract electronics manufacturer Key Electronics will expand its operations here, creating up to 75 new jobs by 2014.

The company plans to invest more than $2.2 million to increase production space at the manufacturing facility.

The firm currently employs more than 150 workers at the 104,000 sq. ft. plant, and plans to begin hiring additional manufacturing staff this spring to help ramp production.

Key Electronics manufactures printed circuit board assemblies for the industrial controls, aerospace, defense, medical, appliance and consumer markets.

REDMOND, WA – Microsoft has filed suit against tech manufacturing heavyweights Foxconn and Inventec over the sale and manufacture of Barnes & Noble's Android-based Nook tablet.

Microsoft alleges patent infringements in the Android-based e-reader and tablet devices presented as Barnes & Noble’s brand.

Barnes & Noble is also a party to the suit. However, while Microsoft firm says Google’s Android infringes Microsoft patents, it did not name Google directly in this suit.

Microsoft alleges patent infringements include “natural ways of interacting with devices by tabbing through various screens to find the information they need, surfing the Web more quickly, and interacting with documents and e-books.”

WASHINGTON – The latest attempt to address American competitiveness will take place here in mid June, in concert with a series of coordinated lobbying efforts.

Formerly known as IPC Capitol Hill Day, the Summit on American Competitiveness will be held June 15-16 and combines targeted presentations with legislative and regulatory briefings. Attendees will also pay visits to various members of Congress to discuss issues that directly impact the US electronics industry’s ability to compete globally.

Apart from the congressional visits, a panel of to-be-named senior electronics executives will share steps they have taken to gain an advantage in the global marketplace. Information on resources such as the Federal Trade Adjustment Assistance Program also will be discussed, and the international factors impacting the industry’s competitiveness will be highlighted.

IPC said the legislator meetings will focus on tax code modifications, future military and aerospace needs, and business regulations.

For more information, visit www.ipc.org/CHD. 

WRIGHT-PATTERSON AFB, OHIO -- The US Air Force research division will provide a grant worth up to $1.6 million for new work that eliminates risks of tin whiskers and related problems.

GLENVIEW, IL -- Illinois Tool Works' Power Systems and Electronics business unit reported revenues climbed 16.5% year-over-year in the February quarter.

EL SEGUNDO, CA -- Offline semiconductor facilities in Japan cannot ramp to full production until the aftershocks cease, a leading analyst asserts.

BOSTON -- What various companies are saying about how the March 11 earthquake in Japan is affecting their production. Updates as of March 29.

SAN JOSE – The 90-day moving average orders for North America-based semiconductor equipment manufacturers rose 26.7% year-over-year in February, according to the industry's top trade group.

JUNDIAI, SAO PAULO, BRAZIL -- Foxconn will reportedly open a manufacturing plant about 60 km north of Sao Paulo where it will build for Apple.

VELLINGE, SWEDEN – Contract manufacturer PartnerTech has informed its customers that the crisis in Japan affects parts of its supply chain, and may cause disorders in the supply of certain products.

ARLINGTON, VA – JEDEC Solid State Technology Association announced a broad spectrum of ongoing standards development work related to 3D-ICs. 

The Solid State Memories Committee (JC-42) has been working since June 2008 on definitions of standardized 3D memory stacks for DDR3. The DDR4 standard will be implemented with 3D support from the start.

The Multiple Chip Packages Committee (JC-63) is currently developing mixed technology pad sequence and device package standards. An active Task Group of the Low Power Memories Subcommittee (JC-42.6) is developing standards for wide I/O mobile memory with TSV interconnect stacked on system on a chip application processors.

The Silicon Devices Reliability Qualification and Monitoring Subcommittee (JC-14.3) has been working on reliability interactions of 3D stacks and has released JEP158: 3D Chip Stack with Through-Silicon Vias (TSVS): Identifying, Understanding and Evaluating Reliability Interactions.  In addition, reliability test methods developed by JC-14.1 and JC-14.2 and quality documents developed by JC-14.4 are applicable to 3D-IC packaged and unpackaged evaluations and qualifications.